Single-chip memory with me?

 
Tessera Technologies, Inc., a wholly owned subsidiary Invensas Inc. announced today that Intel is more than conventional two-die package, the new technology multi-die memory package "XFD" on the bottom of their faces, IDF2011 fall this month in San Francisco form further announced that it will be held in the middle of the show (DDP). Maybe someday in the future, only two we can to make sure that you have a memory or chip.
XFD full name multi-die face-down, are based on the wire (wire bond) and multi-die package, in order to face down the DRAM IC, which is packaged chips and satellites, more windows as well as - The structure of short lines, known as the BGA package:
- Strengthen the capacity of the overall size of the component programs were reduced by more than 25-35 percent of the conventional vertical height of the Lord greatly reduced.
- Enhanced electrical performance, and therefore, balanced performance and yield the balance of upper and lower die can be improved 50-70%.
- To increase heat transfer efficiency of 20-30%, the conventional dual die package (DDP) from.
XFD technology is now in two forms, one of the "DFD" (dual-face down), 11.5 × 11.5 Haomi x4/x8 version of the single chip package, x4/x8 two 104 BGA package that uses the x16 version of the measure / x16 DRAM die is. Or use the 11.5 × 14mm 136 BGA package measuring 11.5 × 11.5 mm.
The second measuring 16.2 × 16.2 ミリメートル, "QFD" (quad face down), single-die chip package four x8/x15 DRAM, 256 BGA package.
If you are worried about memory performance under this package you have, then, the company is Invensas 2133MHz, claiming that its high operating frequency, certified and full commissioning and after.
Invensas is primarily server, data center, XFD packaging technology for laptops and other mobile devices, but the market may still occur if you do not know.

DFD memory chip package

XFD Memory Package

XFD Package Chart

DDF traditional organization chart package